Ceramic Electronic Component Press
Ceramic Electronic Component Press — Technical Specifications, Platen Dimensions & Tooling Sizing
HEMSUN ENGG. INDUSTRIES manufactures the Ceramic Electronic Component Press (Series HSE-763) in Dahegam, Gandhinagar, Gujarat, India for high-performance compaction and moulding of ceramic electronic component press components. Engineered with heavy-duty structural rigidity, programmable pressure dwell (3,000–4,500 psi / 300–500 kg/cm²), precision ejection hydraulics, and PLC touchscreen controls for domestic and export plants.
Applications
- Serial compaction and forming of ceramic electronic component press components for industrial processors (Workstation Ref: APP-7063).
- Integrated die-set tooling for ceramic electronic component press components with automated powder cavity charging and synchronized bottom ejection.
- Programmable density management on ceramic compounds with controlled pressure dwell cycles from 18s to 5min.
- Export-compliant production line equipped with multi-voltage electrical cabinet (380V/60Hz) and complete FAT documentation.
How this press is built
Designed for tight-tolerance fabrication of ceramic electronic component press components, this 339 Ton Ceramic Electronic Component Press integrates closed-loop hydraulic positioning with multi-step compaction curves for parts up to Engineered to client drawing envelope (Build HSE-473). The pressing cycle maintains peak hydraulic load across a 67-second timer dwell, enabling resin particles to mechanically interlock. Programmable decompression stages prevent delamination cracking before the lower hydraulic ejector pin array raises the compacted part.
Material behaviour under compaction
Tailored for high compressibility demands of technical ceramic alumina (96–99.7%) and zirconia powder, the machine provides deep cavity clearance and smooth ram descent. Uniform pressure distribution minimizes internal stress concentrations, preventing micro-cracking during processing.
Tooling and die design
The press table is engineered for rapid die clamping with reinforced bolster plates. In-house manufactured punch and die sets for ceramic electronic component press components utilize through-hardened tool steel with micro-honed surfaces to eliminate wall drag during ejection.
Sizing and machine selection
Configuring the 339 Ton Ceramic Electronic Component Press begins with analyzing part cross-sectional geometry and production volumes. Share your 3D models with HEMSUN for comprehensive sizing calculations and turnkey tooling proposals.
Quality checks and inspection
Each press is tested against strict quality standards at our Dahegam facility: laser alignment of bolsters, continuous pressure dwell cycling, and green compact density verification.
Installation and commissioning
Comprehensive documentation packs accompany each shipment, including foundation details, electrical schematics, hydraulic valve layouts, and PLC program backups. Our service team offers worldwide on-site installation and commissioning.
Export packing and lead time
Prepared for global destinations, the unit includes tailored electrical configurations (480V/60Hz), protective ocean crating, and complete commercial export documentation.
Maintenance and spare parts
Service intervals require hydraulic oil filtration at 1,000-hour marks, routine tie-bar lubrication via manifold grease fittings, and seal inspections. Factory-certified replacement parts and seal overhaul packages ship on short notice.
Safety and guarding
Comprehensive safety equipment includes dual optical light curtains, synchronized two-hand pushbuttons, hydraulic safety drop valves, and protective side mesh panels.
Specifications
| Property | Value |
|---|---|
| Machine Series & Model | Ceramic Electronic Component Press (Series HSE-763) |
| Rated Tonnage Capacity | 200 Ton (High-Tonnage Compression Press) |
| Target Part Size Envelope | Engineered to client drawing envelope (Build HSE-473) |
| Platen Bolster Dimensions | 820 × 820 mm precision 4-pillar platen |
| Daylight & Ram Stroke | 360 mm daylight / 260 mm main ram stroke |
| Specific Compaction Pressure | 2,600–3,900 psi (260–390 kg/cm²) |
| Pressure Dwell Control Band | 10 seconds to 45 seconds high-speed cycle dwell |
| Main Motor & Electricals | 7.5 HP 3-Phase 415V (Proportional hydraulic pack) |
| Hydraulic Reservoir Volume | 230 Liters ISO VG 68 tank with forced-air oil cooler |
| Overall Machine Dimensions | 2250 × 2650 × 3250 mm |
| Automation & PLC Architecture | Electro-Hydraulic Dual-Pushbutton Console with Digital Pressure Readout |
| Manufacturing & Testing Origin | Fabricated, Assembled & Tested at Dahegam, Gandhinagar, Gujarat, India |
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Frequently Asked Questions
What is the Ceramic Electronic Component Press used for?
The Ceramic Electronic Component Press from HEMSUN ENGG. INDUSTRIES is engineered for Serial compaction and forming of ceramic electronic component press components for industrial processors (Workstation Ref: APP-7063).; Integrated die-set tooling for ceramic electronic component press components with automated powder cavity charging and synchronized bottom ejection.; Programmable density management on ceramic compounds with controlled pressure dwell cycles from 18s to 5min.. Share your part drawing, powder type, and annual volume so we can match tonnage, cavity layout, and automation.
Can HEMSUN customize the Ceramic Electronic Component Press tonnage and controls?
Tonnage options include 200 Ton (High-Tonnage Compression Press). Control packages include 10 seconds to 45 seconds high-speed cycle dwell. Configuring the 339 Ton Ceramic Electronic Component Press begins with analyzing part cross-sectional geometry and production volumes. Share your 3D models with HEMSUN for compreh…
Do you install and train operators for the Ceramic Electronic Component Press?
Yes. Installation, commissioning, and operator training are available for domestic and export shipments. Fabricated, Assembled & Tested at Dahegam, Gandhinagar, Gujarat, India. Export documentation (commercial invoice, packing list, certificate of origin) is provided for qualified orders.
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